MICROBONDS

Microbonds is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds' proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20B+ wire bond infrastructure and US $4B+ consumables marketplace. Microbonds technology is proven on coated gold bonding wire and is well positioned to capitalize on the growing market demand for coated copper bonding wires.