J-DEVICES CORP

J-Devices Corporation, a semiconductor back-end manufacturing services company, offers wafer probing, package assembly, final testing, and package development services. It offers package solutions, such as analysis and simulation technologies. The company also provides wafer test and final test equipment, such as MCU, multimedia, mobile communication, and sensor devices. In addition, it offers panel level packaging products for automotive, mobile, analog/RF module, and memory applications.