HANGZHOU LEON DONGXIN MICROELECTRONICS

Hangzhou Leon Dongxin Microelectronics is a supplier of international microwave radio frequency integrated circuit chips. It has developed highly integrated indium gallium phosphorus heterojunction bipolar transistors (InGaP HBT), gallium arsenide pseudo-matched high electron mobility transistors (GaAs pHEMT), and BiHEMT radiofrequency Integrated Circuit (RFIC) production technology, developed VCSEL, DOE, ITO, and Hall sensor production technology. The company has built a production line with an annual output of 50,000 6-inch gallium arsenide chips, breaking through major technical nodes, filling in a number of technical gaps, and leading the technological progress of this industry.