TRU-SI TECHNOLOGIES

Tru-Si Technologies, Inc. serves the global semiconductor industry with innovative technologies for thin wafer processes and new chip-to-chip interconnection structures. Thin wafers are key in producing increasingly smaller, higher density, more functional and less costly chips used in wireless, portable, smart-card, networking and Internet applications. Tru-Si delivers solutions for damage-free wafer thinning, thin-wafer damage and stress removal, ultrathin wafer handling, flexible integration of thin-wafer processing tools and advanced technologies focused on enabling new generations of 3D system-in-a-package (SIP) devices.