PAC TECH - PACKAGING TECHNOLOGIES

Pac Tech GmbH equipment offers semiconductor manufacturers several distinct advantages over other conventional methods. There is virtually no damage to substrates using their patented contactless method of applying solder-balls to fine and thin materials such as those used in hard disk drive head applications. The electroless wafer bumping method has a strong advantage in achieving short lead-time and low-cost compared to existing electroplating methods. As semiconductor geometries become smaller and smaller, the need for very fine-pitch solder-ball placement and wafer level packaging will become even more critical.

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