BOSCHMAN TECHNOLOGIES

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: Smartcards and discrete packages MEMS and sensor packages Leadless and substrate-based packages Special application packages We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.

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