X2F

X2F has developed a new category of molding technology for part manufacturing, leveraging a low pressure and a patented pulse-packing method to mold parts. The X2F approach to molding represents a completely new way to mold materials and throws away constraints of traditional injection molding. Combining specialized hardware, sensing data, and software enables dramatically reduced viscosity and pressure molding. The step change in process parameters enables the use of previously un-moldable mate... rials, the development of new ultra-high performance materials and the design of more intricate shapes to produce “can’t be done” parts. While the capabilities cover a vast set of use-cases, X2F's initial beachhead markets include advanced materials, encapsulated electronics, and optics & lenses for industrial and consumer end markets.More